%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%% \section{Discussion \& Conclusion} \begin{frame} \frametitle{Discussion \& Conclusion} \begin{itemize} \item General structure \begin{itemize} \item Removal of $g_\text{m}$ stage of Gilbert cell $\rightarrow$ more voltage headroom \item High bandwidth TIA and inductive peaking $\rightarrow$ high bandwidth \item Differential to single-ended conversion $\rightarrow$ dense chip-to-package transition \end{itemize} \bigskip % \item Own simulations % \begin{itemize} % \item Much higher conversion gain $\leftarrow$ technology with higher $f_\text{t}$ and $f_\text{max}$, no stability considerations % \end{itemize} % \bigskip \item Applications of this design \begin{itemize} \item SiGe HBT technology integrable with CMOS $\rightarrow$ scalable, suitable for mixed-signal ICs \item Ideal for electronic beam stearing in mm-Wave applications \end{itemize} \end{itemize} \end{frame}